SIP, RF substrate electroforming printing template

The entity diagram is inconvenient to display, and this display diagram is a 3D rendering.

Uses: Used for system-level package printing flux and solder paste.

(Wearable equipment, manufactured by 5G wife elimination electronic package)

Main parameters:

Steel sheet thickness (t): 0.02 ~ 0.05 mm

Thickness error ±0.003mm;

The number of holes is 20,000 to 200,000.

The aperture is ≥0.05mm, and the opening accuracy is ±0.003mm

Opening position accuracy ±0.01mm

The solder paste template can make grooves on the non-printing surface to avoid Flux sticking.

Advantages: The electroforming process has high opening precision, smooth hole wall, good solder paste forming and good demoulding effect; And regardless of the number of holes, it is molded at one time.

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